Renzo Dal Molin
Director of Scientific and Technical Coordination, Sorin CRM
Renzo Dal Molin is the Director of Scientific and Technical Coordination for SORIN CRM (Cardiac Rhythm Management), a business unit of SORIN GROUP. He is in charge to initiate collaborative research and innovation actions for implantable medical devices and associated peripherals. His scope is to foster innovation, which can be industrialized, has a market potential and will be beneficial for the end users. He is involved in smart system integration for pacemakers, defibrillators, neurostimulators, sensors, energy scavengers, batteries, short-range low power wireless communication and healthcare home monitoring systems. He has an expertise in biomaterials, bioelectronics, biopackaging in harsh environments, nanoelectronics, 3D IC heterogeneous integration, ultra low power integrated circuits, MEMS, embedded software, smart system design for enhancing low power, high level of miniaturization, security, privacy, reliability and robustness.
He is Vice Chairman of EPoSS (European Technology Platform on Smart Systems) Chairman of Working Groups Smart Systems for Healthy Living and Applied Micro-Nano-Bio Systems . He is member of EURIPIDES2 board, ECSEL Governing Board and Commission TIC & Santé Paris Région.
He is very active in telecommunication standardization as he was involved in ECC (Electronic Communications Committee) reports 149 and 150 published by CEPT (European Conference of Postal and Telecommunications Administration) and rapporteur of ETSI standards EN 301 559 and EN 301 489-35.
He obtained his master in Electronics and Biomedical Engineering in 1979 from ESSTIN and University of Nancy France. He then occupied in SORIN CRM different positions like hardware & software project engineer, pacemaker & defibrillator project manager, MEMS analog&digital integrated circuits design manager.
He supervised 7 PhD theses. In 2014, the thesis related to energy scavenging received the Jury Prize Gandy in Science from la Chancellerie des Universités de Paris.
In 2014, he received the 3DIncites Awards in Phoenix USA for 3D IC modules in devices.
He holds more than 20 European and US patents and was involved in more than 25 publications.